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    DSAZSAA00019956.pdf by NXP Semiconductors

    • Package outline TFBGA393: plastic thin fine-pitch ball grid array package; 393 balls; body 14 x 14 x 0.7 mm D B SOT861-1 A ball A1 index area E A A2 A1 detail X C e
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    DSAZSAA00019956.pdf preview

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