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    DSAZSAA00019957.pdf by NXP Semiconductors

    • Package outline LFBGA336: plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm D SOT862-1 B A ball A1 index area A E A2 A1 detail X
    • Original
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    DSAZSAA00019957.pdf preview

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