DSAZSAA00019960.pdf by NXP Semiconductors

Partial File Text Package outline HTSSOP24: plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad D SOT864-1 A E c y X expo
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSAZSAA00019960.pdf preview Download Datasheet