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    DSAZSAA00019982.pdf by NXP Semiconductors

    • Package outline LFBGA280: plastic low profile fine-pitch ball grid array package; 280 ball... s; body 11 x 11 x 1 mm B D SOT894-1 A ball A1 index area A E A2 A1 detail X e1 more
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    DSAZSAA00019982.pdf preview

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