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DSAZSAA00019992.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline HLQFN64R; plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 Ã 9 Ã 1.6 mm A B D SOT903-1 terminal 1 index area A
Datasheet Type
Original
ECAD Model
Part Details
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