DSA0060193.pdf by USHA

Partial File Text SPEC SHEET BF495D Chip Appearance Chip Size 400µm x 337.5µm Chip Thickness 230 ± 20µm Base Dia=75µm Emitter Bonding Pad Dimension Dia=75µm 50µm Al Ti - Ni - Ag 4 inch
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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