This site uses third-party website tracking technologies to provide and continually improve our services, and to display advertisements according to users' interests. I agree and may revoke or change my consent at any time with effect for the future.
Thermal Management
New JRC's stepper motor ICs are power Ics encapsulated in Dual in Line (DIP), EMP and PLCC (Plastic Leaded
Chip Carrier) packages. The silicon die is directly bonded to a heat-spr