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    DSAFRAZ004421.pdf

    • Xilinx
    • Packages and Thermal Characteristics ® August 6, 1996 (Version 1.2) Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352
    • Original

    DSAFRAZ004421.pdf preview Download Datasheet

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    .65mm bga land pattern 84-1LMISR4 cb228 footprint clcc land pattern footprint pga 84 MO-83-AF PCB footprint cqfp 132 PG184 PG223-XC4013E QFP Package 128 lead .5mm QFP PACKAGE thermal resistance die down schematic impulse sealer xc4010e-pq208 XC4013E-PQ240 XC7236A XC7272A XC73108 XC73144 XC7318 XC7336 XC7336Q XC7354 XC7372 XC9536 XC9572 xilinx opd0007 xilinx XC6216
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