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    DSAFRAZ004422.pdf by Xilinx

    • Packages and Thermal Characteristics ® June 1, 1996 (Version 1.1) Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 4
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    .65mm bga land pattern 304 QFP amkor BGA 11x11 junction to board thermal resistance diode a112 - 25 -16 b2 EFTEC-64 footprint jedec MS-026 TQFP footprint jedec MS-026 TQFP 128 footprint jedec MS-026 TQFP 144 JEDEC MS-026 footprint JEDEC MS-026 footprint 32 pin JEDEC Package Code MS-026-AED land pattern QFP 208 leadframe C7025 MO-087 MS-026-ACB MS-026-BGA QFP Package 128 lead .5mm schematic impulse sealer Shipping Trays 16x16 XC4010E-PQ208 XC7236A XC7272A XC73108 XC73144 XC7318 XC7336 XC7336Q XC7354 XC7372 XC9536 XC9572 xilinx package dimensions plcc 44 pin Xilinx XC4013
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