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    DSAFRAZ004514.pdf by Xilinx

    • Packages and Thermal Characteristics ® August 6, 1996 (Version 1.2) Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352
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    BGA 11x11 junction to board thermal resistance eftec 64 EFTEC-64 EIA standards 481 footprint jedec MS-026 TQFP footprint jedec MS-026 TQFP 128 JEDEC MS-026 footprint JEDEC Package Code MS-026-AED land pattern PQFP 132 leadframe C7025 MO-113 MO-83-AF MO-83-AH OPQ0003 PCB footprint cqfp 132 PQFP moisture sensitive handling and packaging QFP 128 lead .5mm QFP Package 128 lead .5mm QFP PACKAGE thermal resistance QFP Shipping Trays schematic impulse sealer XC4010E-PQ208 XC4013E-PQ240 xc4013epq240 XC6216 XC7236A XC7272A XC73108 XC73144 XC7318 XC7336 XC7336Q XC7354 XC7372 XC9536 XC9572
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