DSA00334107.pdf by Texas Instruments

Partial File Text PowerFLEX TM Surface-Mount Alternative for Through-Hole Power Packages SZZA015 April 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes
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IPC-SM-782 JESD51-2 land pattern for tvSOP powerflex powerflex ktp r-psfm-g2 SCBA009 SN62 PB36 ag2 SN62 PB36 ag2 heat conductivity TO-220 package thermal resistance TO220 land pattern