DSAZSAA00020022.pdf by NXP Semiconductors
- Package outline LFBGA272: plastic low profile fine-pitch ball grid package; 272 balls; body 15 x 15 x 1 mm B D SOT929-1 A ball A1 index area E A2 A A1 detail X e1 e
- Original
- Unknown
- Unknown
- Unknown
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