DSAZSAA00020084.pdf
- NXP Semiconductors
- Package outline WLCSP9: wafer level chip-size package; 9 balls; 1.3 x 1.3 x 0.6 mm A B D TFA9881UK ball A1 index area A2 E A A1 detail X e1 e â v â w b C
- Original
- Part pricing, stock, data attributes from Findchips.com
