DSAZSAA00020085.pdf by NXP Semiconductors

Partial File Text Package outline WLCSP9: wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm A B D TFA9981UK bump A1 index area A2 E A A1 detail X e1 e âv âw b C
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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