DSAZSAA00020088.pdf by NXP Semiconductors

Partial File Text Package outline WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) A E NX5P1000E NX5P3001/NX18P3001 B A2 ball A1 i
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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