DSAZSAA00020089.pdf by NXP Semiconductors

Partial File Text Package outline WLCSP12: wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm A E NVT4555UK B A2 ball A1 index area A A1 D detail X e1 e ZE2 C Ãv
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