DSAZSAA00020095.pdf by NXP Semiconductors

Partial File Text Package outline WLCSP20: wafer level chip-size package; 20 bumps; 2.5 x 2.5 x 0.6 mm B D LPC11AxxUK A ball A1 index area A2 E A A1 detail X e1 e C C A B C Ãv Ã
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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