DSAZSAA00020096.pdf by NXP Semiconductors

Partial File Text Package outline WLCSP25: wafer level chip-size package; 25 bumps; 2.17 x 2.32 x 0.56 mm B D WLCSP25217X232 A ball A1 index area A2 A E A1 detail X e1 e C C A B C
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSAZSAA00020096.pdf preview Download Datasheet