DSAZSAA00020260.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of XSON10U package SOT1081-1 Hx C Hy Ay By 0.05 D P 0.05 Generic footprint pattern Refer to the
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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DSAZSAA00020260.pdf preview Download Datasheet