DSAZSAA00020269.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of TSOP44 package SOT1131-1 Hx Gx (0.125) P2 Hy Gy By Ay C X D2 (4x) P1 D1 solder paste depo
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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