DSAZSAA00020270.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of HXQFN60U package SOT1134-1 4.1 2.5 1 0.5 0.585 (4Ã) 0.25 0.56 (4Ã) 0.525 (4Ã) 4.5 3.6 0.25 3
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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