DSAZSAA00020277.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of XQFN16 package SOT1161-1 2.35 2.1 CU 1.65 0.4 (12Ã) 0.45 0.22 CU (16Ã) 3.15 1.8 CU 1.65 2.9 C
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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