DSAZSAA00020279.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of HUSON8 package SOT1166-1 Hx Gx D 0.05 P 0.05 Ay Gy By SPy SPy tot SLy nSPy Hy nSPx
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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