DSAZSAA00020289.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of DFN1212-6 package SOT1229 1.5 1.3 0.15 0.35 (6x) 0.15 0.3 0.25 (6x) 0.4 0.15 1.4 1.05 0.2 (6x) 0
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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