DSAZSAA00020484.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of XSON6 package SOT891 1.05 0.5 (6Ã) 1.4 0.6 (6Ã) 0.7 0.15 (6Ã) 0.25 (6Ã) 0.35 solder land p
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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