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DSAE0062481.pdf
by Intel
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Cartridge Packaging 16.1 16 Introduction Intel has introduced a variety of innovative package designs over the years: surface mount, small out-line, very thin package, multilayer molded plast
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243502-001
A-6137
A5723-01
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connector cross reference
edge connectors
ink cartridge chip
outline of the heat slug for JEDEC