DSAUD0022325.pdf

Partial File Text NM1-2012TWC4-01 Feature Viewing angle:140 deg The materials of the chip is InGaN/GaN 2.0mm×1.25mm×0.70mm SMT-LED RoHS compliant lead-free soldering compatible RESIN: EPOXY BONDING
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

DSAUD0022325.pdf preview Download Datasheet