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    DSAE0065395.pdf by Intel

    • Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing pow
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    240817 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 18 BGA package tray 64 Braze Dual-In-Line 16 Packages CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 CERAMIC LEADLESS CHIP CARRIER LCC 52 socket gate count intel 40 pin pdip dimensions intel packaging databook J-Lead, QFP ceramic outline of the heat slug for JEDEC PLCC 68 intel package dimensions QFP Shipping Trays Reliability Data Plastic Packages QFP 240 Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28
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