DSA3H002099.pdf by Xilinx

Partial File Text 100% Material Declaration Data Sheet FFG784 PK405 (v1.2) September 28, 2012 Average Weight: 5.4270 g Component Silicon Die Doped silicon Solder Bump Tin Lead Die Underfill Bisphenol F-type liquid
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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9003-36-5 underfill