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DSA0023375.pdf
Manufacturer
Texas Instruments
Partial File Text
Application Report SPRA953 - December 2003 IC Package Thermal Metrics SC Packaging Development ABSTRACT Many thermal metrics exist for IC packages ranging from ja to jt. Often, these thermal m
Datasheet Type
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ECAD Model
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User Tagged Keywords
QFP PACKAGE thermal resistance
SPRA953
Theta-JC plcc