Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA00297298.pdf

    • -
    • Bourns® Microelectronic Modules Packaging Solutions Device Mounting Technology Surface Mount Technology Surface mounting is still the most common and economical approach for many applications. Bo
    • Original

    DSA00297298.pdf preview Download Datasheet

    User Tagged Keywords

    Dielectric Constant Silicon Nitride fine line bga thermal cycling reliability FR4 epoxy dielectric constant 3.2 FR4 substrate height and thickness ltcc chip underfill
    Price & Stock Powered by Findchips

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel