DSA00299924.pdf by Central Semiconductor

Partial File Text PROCESS CP230 Power Transistor NPN - Silicon Darlington Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 80 X 80 MILS Die Thickness 8 MILS Base Bonding Pad
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSA00299924.pdf preview

Download Datasheet

User Tagged Keywords

"Darlington Transistor" CJD122 CP230 CZT122