DSA00299974.pdf by Central Semiconductor

Partial File Text PROCESS CPD64 Low Leakage Diode Low Leakage Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 17.5 x 17.5 MILS Die Thickness 8.0 MILS Anode Bonding Pad Area
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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1N3595 CMPD3003 CPD64