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    DSA00299976.pdf

    • Central Semiconductor
    • PROCESS CPD74 Switching Diode Monolithic Isolated Quad Switching Diode Chip PROCESS DETAILS Die Size 25 x 25 MILS Die Thickness 6.0 MILS Anode 1, 2, 3, 4 Bonding Pad Area 3
    • Original
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    DSA00299976.pdf preview Download Datasheet

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    CPD74

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