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DSA00299984.pdf
by Central Semiconductor
Partial File Text
PROCESS CPD96V Schottky Diode 500mA Low VF Schottky Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 20 x 20 MILS Die Thickness 7.1 MILS Anode Bonding Pad Ar
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Active
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User Tagged Keywords
CMLSH05-4
CPD96V
diode 29
Schottky diode
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