Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA00299987.pdf

    • Central Semiconductor
    • PROCESS CPZ18 Zener Diode 0.5 Watt Zener Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 14 X 14 MILS Die Thickness 7.5 MILS Anode Bonding Pad Area 7.5 X 7
    • Original

    DSA00299987.pdf preview Download Datasheet

    User Tagged Keywords

    CMPZ5221B CMPZ5234B CPZ18 zener diode chip

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel