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    DSA00299987.pdf

    • Central Semiconductor
    • PROCESS CPZ18 Zener Diode 0.5 Watt Zener Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 14 X 14 MILS Die Thickness 7.5 MILS Anode Bonding Pad Area 7.5 X 7
    • Original
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    DSA00299987.pdf preview Download Datasheet

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    CMPZ5221B CMPZ5234B CPZ18 zener diode chip

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