DSA0028144.pdf by International Rectifier

Partial File Text AN-1011 Wafer Level Package Technology Board Mounting Application Note for 0.800mm pitch devices page Device construction 2 Design considerations 3 Assembly considerations 4
Datasheet Type Original
RoHS No
Pb Free No
Lifecycle Transferred
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IRF6100TR

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desoldering IRF6100 SN63 PB37 PROFILES wafer level package with or without underfill

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