DSAIH00084680.pdf by Central Semiconductor
- PROCESS CPQ166 TRIAC 25 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 165 x 165 MILS Die Thickness 9.1 MILS ± 0.4 MILS MT1 Bonding Pad Area
- Original
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