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DSASW00374190.pdf
by STMicroelectronics
Partial File Text
TN0193 Technical note LRIS64K bumped die description Product information Product name:
...
LRIS64K Wafer and die features Wafer diameter: 8 inches Wafer thickness: 180 µm Die id
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Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
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LRIS64K
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