This site uses third-party website tracking technologies to provide and continually improve our services, and to display advertisements according to users' interests. I agree and may revoke or change my consent at any time with effect for the future.
A New Generation of Wafer Level Packaged HEXFET ® Devices
by Tim Sammon, Hazel Schofield, Aram Arzumanyan, & Dan Kinzer, International Rectifier
As presented at PCIM Europe 2000
Introduction & Summ