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    DSAUD0039353.pdf

    • Bergquist
    • Bond-Ply 100 ® Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape Features and Benefits · Thermal impedance: 0.52°C-in2/W (@50 psi) · High bond strength to a variety
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSAUD0039353.pdf preview Download Datasheet

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    astm D149 ASTM-D-3386 bergquist BP100 D1002
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