DSAZIHA100084795.pdf by Central Semiconductor

Partial File Text PROCESS CP608 Power Transistor PNP - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 66 x 66 MILS Die Thickness 12.5 Â± 1.0 MILS Base Bonding
Datasheet Type Original
RoHS No
Pb Free No
Lifecycle Obsolete
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