DSA2IH0044351.pdf by Not Available

Partial File Text DENSE-PAC MICROSYSTEMS DESCRIPTION: The Dense-Pac LO G IC M O DULE consists of two logic devices in standard JEDEC 20-pad ceramic LCC (Leadless Chip Carrier) packages, surface-mounted on a co-fired
Datasheet Type Scan
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Pb Free Unknown
Lifecycle Unknown

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20-PAD 26LS32 pin diagram

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