DSA2IH0044472.pdf by Not Available

Partial File Text D E N S E -P A C MICROSYSTEMS D ESCRIPTIO N : The D PZ4M W 16N n3 "STACK" modules are a revolutionary new memory subsystem using Dense-Pac M icrosystems' ceram ic Stackable Leadless Chip Carriers
Datasheet Type Scan
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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