DSA00242974.pdf by Amkor Technology

Partial File Text LAMINATE data sheet Package on Package (PoP) Family PSvfBGA Package Stackable Very Thin Fine Pitch BGA (PSvfBGA): After 3 years of development in package stacking technology and infrastr
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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Amkor CSP mold compound Amkor Wafer level mold compound Die B3 JEDEC Jc-11 free jedec package standards PoP PACKAGE TESTING PSVFBGA