The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSASW00416660.pdf
by White Electronic Designs
Partial File Text
White Electronic Designs WEDPN4M72V-XB2X WEDPN4M64V-XBX PBGA MULTI-CHIP PACKAGE CONSTRUC
...
TION ENCAPSULANT TEST Thickness around die = 0.015" to 0.020" typical Burn-In 100%-48 hours a
more
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
Price & Stock
Find it at Findchips.com
DSASW00416660.pdf
preview
Download Datasheet
User Tagged Keywords
WEDPN4M64V-XBX
WEDPN4M72V-XB2X
Price & Stock Powered by