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    DSASW00416660.pdf by White Electronic Designs

    • White Electronic Designs WEDPN4M72V-XB2X WEDPN4M64V-XBX PBGA MULTI-CHIP PACKAGE CONSTRUC... TION ENCAPSULANT TEST Thickness around die = 0.015" to 0.020" typical Burn-In ­ 100%-48 hours a more
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