DSASW00416677.pdf by White Electronic Designs

Partial File Text W332M64V-XSBX Application Note W332M64V-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST Thickness around die = 0.015 to 0.020 typical The encapsulant is not injection molded to co
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSASW00416677.pdf preview

Download Datasheet

User Tagged Keywords

SN63 PB37 W332M64V-XSBX