The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSASW00416722.pdf
Partial File Text
2ND LEVEL INTERCONNECT RELIABILITY OF CERAMIC AREA ARRAY PACKAGES Shingo Sato, Noriyuki Shimizu*, Shin Matsuda, Shoji Uegaki and Sachio Ninomiya Kyocera Corporation Kyoto, Japan Biography Dur
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
DSASW00416722.pdf
preview
Download Datasheet
User Tagged Keywords
0.65mm pitch BGA
BGA cte
BGA Solder Ball collapse
bga thermal cycling reliability
cte table ic bga
DIMPLE BGA
FR4 0.8mm thickness