DSA00491500.pdf by Vitesse Semiconductor

Partial File Text VITESSE SEMICONDUCTOR CORPORATION Application Note Thermal Management for the VSC870, VSC880 AN-36 Thermal Management The VSC870 and VSC880 backplane devices can use standard heat sinks
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192 BGA PACKAGE thermal resistance 2319B 658-35AB elina fan G53034-0 heat sink for 304 point BGA VSC870 VSC880